EP4CGX110DF27I7N vs EP4CGX110DF31I7 Comparación
Comparación detallada lado a lado de EP4CGX110DF27I7N por Intel y EP4CGX110DF31I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF27I7N | EP4CGX110DF31I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $276,34 |
| Series | Cyclone IV GX | Cyclone IV GX |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | — |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V typical |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Encapsulado | 672-ball FBGA, 1.0 mm pitch | 896-BGA (FBGA-896), 31 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Device Logic Elements | — | 109,424 |
| Total Memory Bits | — | 5,621,760 |
| Number of Logic Array Blocks (LABs) | — | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | — | 475 user I/O |
| Multipliers (18x18) | — | 432 |
| M9K Memory Blocks | — | 270 |
| Ball Pitch | — | 0.8 mm |
| Speed Grade | — | -7 |
| Temperature Grade | — | Industrial (-40C to +100C Tj) |
| Configuration Method | — | SRAM (EPCS or JTAG) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |