EP4CGX110DF27I7N vs EP4CGX50DF27I8N Comparación
Comparación detallada lado a lado de EP4CGX110DF27I7N por Intel y EP4CGX50DF27I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF27I7N | EP4CGX50DF27I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $58,90 |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | 2,562,048 |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 4 |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Encapsulado | 672-ball FBGA, 1.0 mm pitch | 672-ball FineLine BGA (F27) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Family | — | Cyclone IV GX |
| Embedded Memory Blocks | — | 250 x M9K |
| 18 x 18 Multipliers | — | 200 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 310 |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| PCI Express Hard IP | — | Gen1 x1/x2/x4 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | 8 (fastest) |
| Temperature Grade | — | Industrial (-40 C to +100 C) |