EP4CGX110DF27I7N vs EP4CGX50DF27I8N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF27I7N von Intel und EP4CGX50DF27I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF27I7N | EP4CGX50DF27I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $198,00 | $58,90 |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | 2,562,048 |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 4 |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 672-ball FBGA, 1.0 mm pitch | 672-ball FineLine BGA (F27) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Family | — | Cyclone IV GX |
| Embedded Memory Blocks | — | 250 x M9K |
| 18 x 18 Multipliers | — | 200 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 310 |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| PCI Express Hard IP | — | Gen1 x1/x2/x4 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | 8 (fastest) |
| Temperature Grade | — | Industrial (-40 C to +100 C) |