EP4CGX30BF14C7N vs EP4CGX30BF14I6N Comparación
Comparación detallada lado a lado de EP4CGX30BF14C7N por Intel y EP4CGX30BF14I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX30BF14C7N | EP4CGX30BF14I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $55,78 | $23,10 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 29,440 | — |
| Logic Array Blocks (LABs) | 1840 | — |
| Total Memory Bits | 1,105,920 bits | — |
| Embedded Memory | M9K blocks | — |
| Maximum User I/O | 72 | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI | — |
| Transceivers | Up to 3.125 Gbps (channel count [DATA_NEEDED: per-package transceiver count]) | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Encapsulado | 169-LBGA (FineLine BGA, 14x14 mm) | 169-Ball FBGA (F14) |
| Speed Grade | 7 (commercial) | I6 (industrial) |
| Temperatura de funcionamiento | 0°C to +85°C (commercial C) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial, Fast Passive Serial, JTAG, AS, AP | — |
| DSP Blocks | Embedded 18x18 multipliers | Embedded multipliers (18x18) |
| Estado RoHS | Compliant | — |
| Tensión de alimentación | 1.2 V core, 2.5 V / 3.3 V I/O (per bank) | — |
| Logic Elements | — | 29,440 |
| Core Voltage | — | 1.2 V |
| User I/O Pins | — | 72 (max) |
| Embedded Memory Bits | — | 1,105,920 |
| Transceiver Channels | — | 4 (3.125 Gbps) |
| PLLs | — | 2 |
| Operating Temperature (Junction) | — | -40C to +100C |
| Configuration Method | — | SRAM-based, requires external flash |
| Hard Memory Controllers | — | DDR/DDR2/QDRII SDRAM |