EP4CGX50CF23C7 vs EP4CGX50CF23C7N Comparación
Comparación detallada lado a lado de EP4CGX50CF23C7 por Intel y EP4CGX50CF23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50CF23C7 | EP4CGX50CF23C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $55,10 | $110,50 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Logic Cells | 49,888 | — |
| Embedded Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks | M9K blocks, 9 Kbit each | — |
| Maximum User I/O | 290 | — |
| Encapsulado | 484-FBGA (F23) | 484-FBGA (F23, 23 x 23 mm) |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm TSMC low-power |
| Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C7 | C7 (commercial) |
| Transceivers | Integrated (Cyclone IV GX) | — |
| DSP Blocks | 18x18 hardware multipliers | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Tipo de montaje | Surface Mount (FBGA) | Surface Mount |
| Logic Elements (LE) | — | 49,888 |
| Embedded Memory (Bits) | — | 2,562,048 (2.5 Mb) |
| User I/O | — | 290 |
| Logic Array Blocks | — | 47 |
| Multi-Gigabit Transceivers | — | 4 channels up to 3.125 Gbps |
| Hard Memory Controllers | — | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) |
| I/O Voltage Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) |
| Temperatura de funcionamiento | — | -40C to +85C (commercial) |
| Configuration Modes | — | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel |