EP4CGX50CF23C7 vs EP4CGX50CF23C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7 von Intel und EP4CGX50CF23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7 | EP4CGX50CF23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,10 | $110,50 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Logic Cells | 49,888 | — |
| Embedded Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks | M9K blocks, 9 Kbit each | — |
| Maximum User I/O | 290 | — |
| Gehäuse | 484-FBGA (F23) | 484-FBGA (F23, 23 x 23 mm) |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm TSMC low-power |
| Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C7 | C7 (commercial) |
| Transceivers | Integrated (Cyclone IV GX) | — |
| DSP Blocks | 18x18 hardware multipliers | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Montageart | Surface Mount (FBGA) | Surface Mount |
| Logic Elements (LE) | — | 49,888 |
| Embedded Memory (Bits) | — | 2,562,048 (2.5 Mb) |
| User I/O | — | 290 |
| Logic Array Blocks | — | 47 |
| Multi-Gigabit Transceivers | — | 4 channels up to 3.125 Gbps |
| Hard Memory Controllers | — | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) |
| I/O Voltage Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) |
| Betriebstemperatur | — | -40C to +85C (commercial) |
| Configuration Modes | — | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel |