EP4CGX50CF23C7N vs EP4CGX50CF23C8 Comparación
Comparación detallada lado a lado de EP4CGX50CF23C7N por Intel y EP4CGX50CF23C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50CF23C7N | EP4CGX50CF23C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $110,50 | $99,79 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Encapsulado | 484-FBGA (F23, 23 x 23 mm) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | C7 (commercial) | 8 |
| Temperatura de funcionamiento | -40C to +85C (commercial) | — |
| Process Technology | 60 nm TSMC low-power | 60 nm |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | — |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Device Logic Elements | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Embedded Memory (bits) | — | 2,562,048 |
| User I/O Pins | — | 290 |
| Transceivers | — | Up to 8 x 3.125 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | 4 |
| Operating Temperature Grade | — | Commercial (C) |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |