EP4CGX50CF23C7N vs EP4CGX50CF23C8 Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7N von Intel und EP4CGX50CF23C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7N | EP4CGX50CF23C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $110,50 | $99,79 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Gehäuse | 484-FBGA (F23, 23 x 23 mm) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | C7 (commercial) | 8 |
| Betriebstemperatur | -40C to +85C (commercial) | — |
| Process Technology | 60 nm TSMC low-power | 60 nm |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | — |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Device Logic Elements | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Embedded Memory (bits) | — | 2,562,048 |
| User I/O Pins | — | 290 |
| Transceivers | — | Up to 8 x 3.125 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | 4 |
| Operating Temperature Grade | — | Commercial (C) |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |