EP4SGX530KH40C3 vs EP4SGX530KH40C2 Comparación
Comparación detallada lado a lado de EP4SGX530KH40C3 por Intel y EP4SGX530KH40C2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530KH40C3 | EP4SGX530KH40C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8.650,00 | $2.150,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | — |
| Transceiver Data Rate | Up to 8.5 Gbps | Up to 8.5 Gbps per channel |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Encapsulado | 1517-BBGA, FCBGA | — |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Device Type | — | FPGA - Field Programmable Gate Array |
| LABs / CLBs | — | 21,248 |
| Total RAM Bits | — | 28,033,024 |
| Number of I/Os | — | 744 |
| Number of Transceivers | — | 48 channels |
| Internal Frequency | — | 800 MHz |
| Process Technology | — | 40 nm CMOS |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 42.50 x 42.50 mm |
| Temperatura de funcionamiento | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes |