EP4SGX530KH40C3 vs EP4SGX530KH40C2 Comparaison
Comparaison détaillée côte à côte de EP4SGX530KH40C3 par Intel et EP4SGX530KH40C2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX530KH40C3 | EP4SGX530KH40C2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8 650,00 | $2 150,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | — |
| Transceiver Data Rate | Up to 8.5 Gbps | Up to 8.5 Gbps per channel |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Boîtier | 1517-BBGA, FCBGA | — |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Device Type | — | FPGA - Field Programmable Gate Array |
| LABs / CLBs | — | 21,248 |
| Total RAM Bits | — | 28,033,024 |
| Number of I/Os | — | 744 |
| Number of Transceivers | — | 48 channels |
| Internal Frequency | — | 800 MHz |
| Process Technology | — | 40 nm CMOS |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 42.50 x 42.50 mm |
| Température de fonctionnement | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes |