EPF10K130EFC484-3 vs EPF10K130EFI484-2 Comparación
Comparación detallada lado a lado de EPF10K130EFC484-3 por Intel y EPF10K130EFI484-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K130EFC484-3 | EPF10K130EFI484-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $178,92 | $92,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | 0.6 ns |
| Speed Grade | -3 | — |
| Temperatura de funcionamiento | 0 C to +70 C (commercial) | 0 °C to 70 °C (commercial) |
| Encapsulado | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Logic Elements / Cells | — | 6,656 |
| Equivalent Gate Count | — | 130,000 gates |
| Total RAM Bits | — | 65,536 bits |
| User I/Os | — | 274 |
| Number of Logic Array Blocks | — | 1,664 LABs |
| Number of Embedded Array Blocks | — | [DATA_NEEDED: EAB count] |
| Internal Clock Frequency | — | 333.33 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (PCI-compliant) |
| Process Technology | — | 0.22 µm CMOS |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |