EPF10K130EFC484-3 vs EPF10K130EFI484-2 Сравнение
Подробное сравнение бок о бок EPF10K130EFC484-3 от Intel и EPF10K130EFI484-2 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EPF10K130EFC484-3 | EPF10K130EFI484-2 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $178,92 | $92,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | 0.6 ns |
| Speed Grade | -3 | — |
| Рабочая температура | 0 C to +70 C (commercial) | 0 °C to 70 °C (commercial) |
| Корпус | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Logic Elements / Cells | — | 6,656 |
| Equivalent Gate Count | — | 130,000 gates |
| Total RAM Bits | — | 65,536 bits |
| User I/Os | — | 274 |
| Number of Logic Array Blocks | — | 1,664 LABs |
| Number of Embedded Array Blocks | — | [DATA_NEEDED: EAB count] |
| Internal Clock Frequency | — | 333.33 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (PCI-compliant) |
| Process Technology | — | 0.22 µm CMOS |
| Уровень MSL | — | [DATA_NEEDED: MSL rating] |