EPF10K130EFC484-3 vs EPF10K130EFI484-2 Comparaison
Comparaison détaillée côte à côte de EPF10K130EFC484-3 par Intel et EPF10K130EFI484-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K130EFC484-3 | EPF10K130EFI484-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $178,92 | $92,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | 0.6 ns |
| Speed Grade | -3 | — |
| Température de fonctionnement | 0 C to +70 C (commercial) | 0 °C to 70 °C (commercial) |
| Boîtier | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Logic Elements / Cells | — | 6,656 |
| Equivalent Gate Count | — | 130,000 gates |
| Total RAM Bits | — | 65,536 bits |
| User I/Os | — | 274 |
| Number of Logic Array Blocks | — | 1,664 LABs |
| Number of Embedded Array Blocks | — | [DATA_NEEDED: EAB count] |
| Internal Clock Frequency | — | 333.33 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (PCI-compliant) |
| Process Technology | — | 0.22 µm CMOS |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |