EPF10K200EBC600-1 vs EPF10K200EBC600-2 Comparación
Comparación detallada lado a lado de EPF10K200EBC600-1 por Intel y EPF10K200EBC600-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparación de especificaciones
| Parámetro | EPF10K200EBC600-1 | EPF10K200EBC600-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $322,17 | $198,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | FLEX-10KE | — |
| Logic Elements | 9,984 | — |
| Embedded Memory | 98,304 bits | — |
| Logic Array Blocks | 1,248 LABs | — |
| I/O Count | 470 I/O | — |
| Tensión de alimentación | 2.5 V | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| Encapsulado | 600-BGA | — |
| Technology | Mixed CMOS | — |
| Commercial Temperature | 85 C | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Embedded Array | Enhanced embedded array | — |
| Memory Feature | Dual-port memory | — |
| Estado RoHS | unknown | unknown |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 45 × 45 mm |
| Operating Current | [DATA_NEEDED: operating current] | — |
| Pinout | [DATA_NEEDED: 600-BGA ball map] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Temperatura de funcionamiento | — | 0°C to +70°C (Commercial) |
| Tipo de montaje | — | Surface Mount |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |