EPF10K200EBC600-1 vs EPF10K200EBC600-2 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200EBC600-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Device Family FLEX-10KE —
Logic Elements 9,984 —
Embedded Memory 98,304 bits —
Logic Array Blocks 1,248 LABs —
I/O Count 470 I/O —
Supply Voltage 2.5 V 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
Package 600-BGA —
Technology Mixed CMOS —
Commercial Temperature 85 C —
Propagation Delay 0.4 ns 0.4 ns
Embedded Array Enhanced embedded array —
Memory Feature Dual-port memory —
RoHS Status unknown unknown
Configuration Interface [DATA_NEEDED: configuration interface] —
Package Dimensions [DATA_NEEDED: package dimensions] 45 × 45 mm
Operating Current [DATA_NEEDED: operating current] —
Pinout [DATA_NEEDED: 600-BGA ball map] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Process Technology — 0.30 µm CMOS
Typical Gate Count — 200,000 gates
Logic Elements (LEs) — 9984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Maximum User I/O — 470 pins
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Operating Temperature — 0°C to +70°C (Commercial)
Mounting Type — Surface Mount
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete

Datasheets & Resources

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