EPF10K200EBC600-1 vs EPF10K200EBC600-2 Comparaison
Comparaison détaillée côte à côte de EPF10K200EBC600-1 par Intel et EPF10K200EBC600-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparaison des spécifications
| Paramètre | EPF10K200EBC600-1 | EPF10K200EBC600-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $322,17 | $198,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | FLEX-10KE | — |
| Logic Elements | 9,984 | — |
| Embedded Memory | 98,304 bits | — |
| Logic Array Blocks | 1,248 LABs | — |
| I/O Count | 470 I/O | — |
| Tension d'alimentation | 2.5 V | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| Boîtier | 600-BGA | — |
| Technology | Mixed CMOS | — |
| Commercial Temperature | 85 C | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Embedded Array | Enhanced embedded array | — |
| Memory Feature | Dual-port memory | — |
| Statut RoHS | unknown | unknown |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 45 × 45 mm |
| Operating Current | [DATA_NEEDED: operating current] | — |
| Pinout | [DATA_NEEDED: 600-BGA ball map] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Température de fonctionnement | — | 0°C to +70°C (Commercial) |
| Type de montage | — | Surface Mount |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |