EPF10K200EFC672-2 vs EPF10K130EFC672-2X Comparación
Comparación detallada lado a lado de EPF10K200EFC672-2 por Intel y EPF10K130EFC672-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K200EFC672-2 | EPF10K130EFC672-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $210,00 | $92,00 |
| Family | FLEX 10KE | — |
| Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| Maximum User I/Os | 470 | — |
| Embedded Memory | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Encapsulado | 672-BBGA (FineLine BGA) | 672-FBGA (FineLine BGA, 27x27 mm) |
| Package Dimensions | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | 1.0 mm |
| Process Technology | 0.22 um CMOS | 0.22 μm CMOS SRAM |
| Speed Grade | -2 | — |
| Propagation Delay | 0.4 ns | — |
| Temperatura de funcionamiento | 0 C to 70 C | 0C to +70C (commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Programmability | JTAG (IEEE 1149.1) / in-system | — |
| Estado RoHS | Compliant (per distributor listing) | [DATA_NEEDED: RoHS compliance status] |
| Logic Family | CMOS | CMOS, SRAM-based |
| Series | — | FLEX 10KE |
| Number of Logic Elements (LEs) | — | 6656 |
| Number of Logic Array Blocks (LABs) | — | 832 |
| Total RAM Bits | — | 65536 |
| Number of User I/Os | — | 413 |
| Number of DLLs | — | 4 |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) |
| Configuration Method | — | Serial configuration device, JTAG |
| Tipo de montaje | — | Surface Mount (BGA) |