EPF10K30EFC256-1X vs EPF10K30EFC256-2X Comparación
Comparación detallada lado a lado de EPF10K30EFC256-1X por Intel y EPF10K30EFC256-2X por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
EPF10K30EFC256-1X ObsoleteAltera
EPF10K30EFC256-2X - 30K FLEX-10KE FPGA 1728 Cells 256-BGA | Intel / Altera
EPF10K30EFC256-2X ObsoleteComparación de especificaciones
| Parámetro | EPF10K30EFC256-1X | EPF10K30EFC256-2X |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $95,60 | $17,95 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 1728 | — |
| Typical Gates | 30,000 | — |
| Logic Array Blocks (LABs) | 216 | — |
| Embedded Memory (EAB RAM) | 24,576 bits (6 EABs of 4 Kbit each) | — |
| User I/O | 176 | — |
| Maximum Internal Frequency | 250 MHz | — |
| Propagation Delay (tpd) | 0.4 ns to 0.6 ns | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | — |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5 V | — |
| Encapsulado | 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) | — |
| Speed Grade | -1X (fastest commercial) | -2 |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | 0°C to 70°C |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | — |
| Phase-Locked Loops | 4 | — |
| Compliance | RoHS (check distributor for specific lot), Pb-free option available | — |
| Series | — | FLEX-10KE |
| Gates | — | 30,000 |
| Logic Elements / Cells | — | 1,728 |
| Number of LABs/CLBs | — | 216 |
| Number of Logic Elements/Cells | — | 1,728 |
| Total RAM Bits | — | 24,576 |
| Number of I/O | — | 176 |
| Voltage - Supply | — | 2.375 V to 2.625 V |
| Internal Frequency (Max) | — | 200 MHz |
| Propagation Delay | — | 0.6 ns |
| Technology | — | 0.22 µm CMOS |
| Supplier Device Package | — | 256-FBGA (17x17) |
| Encapsulado / Carcasa | — | 256-BGA |
| Tipo de montaje | — | Surface Mount |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |