EPF10K30ETC144-3N vs EPF10K30ETI144-3 Comparación
Comparación detallada lado a lado de EPF10K30ETC144-3N por Intel y EPF10K30ETI144-3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K30ETC144-3N | EPF10K30ETI144-3 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $26,75 | $29,80 |
| Family | FLEX 10KE | FLEX-10KE Embedded Programmable Logic Device |
| Logic Family | CMOS | — |
| Typical Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | — |
| User I/Os | 102 | — |
| Número de pines | 144 | — |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) | — |
| Package Code | LFQFP | — |
| Terminal Form | Gull Wing | — |
| Tipo de montaje | Surface Mount | Surface Mount (Gull Wing) |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) | -40C to +85C (Industrial) |
| Propagation Delay | 0.6 ns (typical) | — |
| Internal Frequency | [DATA_NEEDED: internal frequency max] | — |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration | — |
| Configuration Memory | Volatile SRAM (requires external configuration device) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (Sn/Pb lead finish) |
| Series | — | FLEX-10KE |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Embedded Array Blocks (EABs) | — | 6 |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Encapsulado | — | 144-LQFP (LFQFP) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |