EPF10K30ETC144-3N vs EPF10K30ETI144-3 Comparaison
Comparaison détaillée côte à côte de EPF10K30ETC144-3N par Intel et EPF10K30ETI144-3 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K30ETC144-3N | EPF10K30ETI144-3 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $26,75 | $29,80 |
| Family | FLEX 10KE | FLEX-10KE Embedded Programmable Logic Device |
| Logic Family | CMOS | — |
| Typical Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | — |
| User I/Os | 102 | — |
| Nombre de broches | 144 | — |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) | — |
| Package Code | LFQFP | — |
| Terminal Form | Gull Wing | — |
| Type de montage | Surface Mount | Surface Mount (Gull Wing) |
| Technology | 0.22 µm CMOS, SRAM-based | — |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) | -40C to +85C (Industrial) |
| Propagation Delay | 0.6 ns (typical) | — |
| Internal Frequency | [DATA_NEEDED: internal frequency max] | — |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration | — |
| Configuration Memory | Volatile SRAM (requires external configuration device) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (Sn/Pb lead finish) |
| Series | — | FLEX-10KE |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Embedded Array Blocks (EABs) | — | 6 |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Boîtier | — | 144-LQFP (LFQFP) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |