EPF6016AFC256-3 vs EPF10K30EFC256-3 Comparación
Comparación detallada lado a lado de EPF6016AFC256-3 por Intel y EPF10K30EFC256-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF6016AFC256-3 | EPF10K30EFC256-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,10 | $24,60 |
| Family | FLEX 6000 | FLEX 10KE |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | 216 |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | — |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.22 micrometer CMOS |
| Core Supply Voltage | 3.3 V | — |
| Encapsulado | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA |
| Recuento de pines | 256 | — |
| Speed Grade | -3 | -3 (fastest) |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Typical Gates | — | 30,000 |
| Logic Elements / Cells | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| User I/O Pins | — | 176 |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V (multi-voltage I/O standard support) |
| Temperature Grade | — | Commercial |
| Configuration Interface | — | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |