EPF6016AFC256-3 vs EPF10K30EFC256-3 Vergleich
Detaillierter Direktvergleich von EPF6016AFC256-3 von Intel und EPF10K30EFC256-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF6016AFC256-3 | EPF10K30EFC256-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $24,60 |
| Family | FLEX 6000 | FLEX 10KE |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 16K | — |
| Logic Elements (LEs) | 1320 | — |
| Logic Array Blocks (LABs) | 132 | 216 |
| User I/Os | 171 | — |
| Maximum Internal Frequency | 142.86 MHz | — |
| Edge Rate | 172 MHz | — |
| Process Technology | 0.42 µm CMOS | 0.22 micrometer CMOS |
| Core Supply Voltage | 3.3 V | — |
| Gehäuse | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA |
| Pin-Anzahl | 256 | — |
| Speed Grade | -3 | -3 (fastest) |
| Configuration Method | SRAM (volatile, requires external PROM) | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Typical Gates | — | 30,000 |
| Logic Elements / Cells | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| User I/O Pins | — | 176 |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V (multi-voltage I/O standard support) |
| Temperature Grade | — | Commercial |
| Configuration Interface | — | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |