EPM240T100C3 vs EPM240GT100C3 Comparación
Comparación detallada lado a lado de EPM240T100C3 por Intel y EPM240GT100C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM240T100C3 | EPM240GT100C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,45 | $9,95 |
| Series | MAX II | — |
| Device Family | EPM240 (MAX II G) | — |
| Logic Elements | 240 | — |
| Macrocells | 192 | — |
| User I/Os | 80 | — |
| User Flash Memory | 8 Kbit (approx., non-volatile) | — |
| Internal Supply Voltage | 2.5 V or 3.3 V | — |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) | — |
| Programmable Type | In-System Programmable (ISP) via JTAG | — |
| Propagation Delay | [DATA_NEEDED: tPD specification] | — |
| Encapsulado / Carcasa | 100-TQFP (14x14 mm) | — |
| Supplier Device Package | TQFP-100 | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 °C to 85 °C (commercial, C3 suffix) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 (168 hours) |
| Estado RoHS | Compliant (per distributor listings) | — |
| Family | — | MAX II |
| Logic Elements (LE) | — | 240 |
| Equivalent Macro Cells | — | 192 |
| Pin-to-Pin Delay (tPD) | — | 4.7 ns |
| Maximum Internal Frequency (fMAX) | — | 304 MHz |
| User I/O Count | — | 80 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage | — | 1.8 V (internal) |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | — | IEEE 1149.1 JTAG (ISP) |
| Encapsulado | — | TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch) |