EPM570F256C4N vs EPM570GF256C3 Comparación
Comparación detallada lado a lado de EPM570F256C4N por Intel y EPM570GF256C3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570F256C4N | EPM570GF256C3 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $26,85 | $10,40 |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | — |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit |
| Encapsulado | 256-ball FineLine BGA (FBGA) | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um 6-layer-metal flash |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Rango de temperatura de funcionamiento | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Family | — | MAX II |
| Device Model | — | EPM570 |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User I/Os (max, FBGA-256) | — | 212 |
| Propagation Delay tPD1 | — | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | — | 300 MHz |
| Supply Voltage VCCINT | — | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature (commercial) | — | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |
| Nivel MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | — | Supported across EPM570 / EPM1270 / EPM2210 |