EPM570GF256C4 vs EPM570F256C4N Comparación
Comparación detallada lado a lado de EPM570GF256C4 por Intel y EPM570F256C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GF256C4 | EPM570F256C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $29,85 | $26,85 |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | — |
| Encapsulado | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA) |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm CMOS, flash-based configuration | 0.18 µm 6-layer-metal flash |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP | — |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) | — |
| Estado RoHS | Lead-free, RoHS compliant | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 570 LE |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Package Size | — | 17 mm × 17 mm |
| Maximum Internal Frequency | — | 304 MHz |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Rango de temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |