EPM570GM256C5N vs EPM570M256C5N Comparación
Comparación detallada lado a lado de EPM570GM256C5N por Intel y EPM570M256C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GM256C5N | EPM570M256C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,60 | $19,45 |
| Series | MAX II | EPM570 |
| Family | CPLD - Complex Programmable Logic Device | MAX II |
| Macro Cells | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | — |
| Number of I/Os | 160 | — |
| Maximum Operating Frequency | 304 MHz | 201.1 MHz |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz | — |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns | — |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) | — |
| Process Technology | 0.18 um flash-based CMOS | 0.18 µm CMOS, non-volatile Flash |
| Programmable Type | In System Programmable (ISP) via JTAG | — |
| Encapsulado / Carcasa | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | 0°C to +85°C (commercial) |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | — |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot | — |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| JTAG Support | Yes (IEEE 1149.1 / 1532) | — |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | — | 440 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O Banks | — | 2.5 V / 3.3 V |
| User I/O Pins | — | 212 (max, package-limited) |
| User Flash Memory | — | 8 Kbits |
| Encapsulado | — | 256-MBGA (Micro FineLine BGA), 1.0 mm pitch |
| Tipo de montaje | — | Surface Mount |
| Configuration Interface | — | JTAG (IEEE 1149.1) / in-system programmable |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |