EPM570GM256C5N vs EPM570ZM256C6N Comparación
Comparación detallada lado a lado de EPM570GM256C5N por Intel y EPM570ZM256C6N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GM256C5N | EPM570ZM256C6N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,60 | $24,10 |
| Series | MAX II | MAX II |
| Family | CPLD - Complex Programmable Logic Device | — |
| Macro Cells | 440 | — |
| Logic Array Blocks (LABs) | 57 | — |
| Number of I/Os | 160 | — |
| Maximum Operating Frequency | 304 MHz | — |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz | — |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns | — |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) | — |
| Process Technology | 0.18 um flash-based CMOS | 0.18 micron CMOS, 6-layer-metal flash |
| Programmable Type | In System Programmable (ISP) via JTAG | In System Programmable (Flash, non-volatile) |
| Encapsulado / Carcasa | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | — |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | 0C to +85C (commercial) |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | — |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot | — |
| Configuration Memory | Internal flash (non-volatile, instant-on) | — |
| JTAG Support | Yes (IEEE 1149.1 / 1532) | — |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package | — |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| User Flash Memory | — | 8 Kbits |
| Encapsulado | — | 256-MBGA (FineLine BGA) 11x11 mm |
| Pin/Pitch | — | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | — | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | — | 9 ns (per Heisener listing for Z speed grade) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Estado RoHS | — | Lead-free (per Heisener listing) |