H5AN8G8NAFR-UHC vs H5AN8G8NAFR-VKC Comparación
Comparación detallada lado a lado de H5AN8G8NAFR-UHC por SK hynix y H5AN8G8NAFR-VKC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5AN8G8NAFR-UHC | H5AN8G8NAFR-VKC |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $4,15 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organización de memoria | 1G x 8 | 1G x 8 |
| Velocidad de datos | 2400 Mbps/pin (PC2400) | — |
| Supply Voltage (VDD) | 1.2 V (DDR4 standard) | 1.2 V |
| Interfaz | CMOS, synchronous | SSTL12 |
| Encapsulado | FBGA-78 (PBGA78) | 78-ball FBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family | H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC | — |
| Speed Grade Suffix | UHC | — |
| Estado RoHS | Compliant (Lead-Free & Halogen-Free) | Compliant (Lead-Free & Halogen-Free) |
| Application Class | Main memory (high density, high bandwidth) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| CAS Latency (CL) | [DATA_NEEDED: CAS Latency] | — |
| Refresh | [DATA_NEEDED: Refresh specification] | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Speed Grade | — | DDR4-2666 (VKC bin) |
| Burst Length | — | 8 (BL8) |
| Bank Group Architecture | — | Supported (per DDR4 JEDEC architecture) |
| On-Die Termination (ODT) | — | Yes |
| DLL | — | Yes (DLL for output skew control) |
| Process Technology | — | CMOS |
| Recommended Application | — | Main memory requiring large density and high bandwidth |