H5ANAG6NCR-PBC vs H5ANAG6NAMR-UHC Comparación
Comparación detallada lado a lado de H5ANAG6NCR-PBC por SK hynix y H5ANAG6NAMR-UHC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5ANAG6NCR-PBC | H5ANAG6NAMR-UHC |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $70,20 | $4,50 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16Gb (2GB) | — |
| Organización de memoria | x16 (1G x 16) | 1G x 16 |
| Tensión de alimentación | 1.14 V to 1.26 V (nominal 1.2 V) | — |
| Transfer Rate | 3200 Mbps (family, per XNCR datasheet; PBC speed grade [DATA_NEEDED: exact speed grade Mbps]) | — |
| Encapsulado | FBGA-96 | FBGA-96 (PBGA96) |
| Number of Terminals | 96 balls | — |
| Temperatura de funcionamiento | 0C to 85C | [DATA_NEEDED: operating temperature range] |
| Tipo de montaje | Surface Mount | Surface Mount (BGA solder ball) |
| Auto Self-Refresh | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Data Mask | Yes | — |
| Dynamic ODT | Yes | — |
| ZQ Calibration | Yes | — |
| CRC Function | Yes | — |
| Write Leveling | Yes | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Maximum Standby Current | [DATA_NEEDED: maximum standby current for PBC speed grade] | — |
| Latencia CAS | [DATA_NEEDED: CAS latency for PBC speed grade] | [DATA_NEEDED: CL for UHC bin] |
| Memory Density | — | 16 Gbit (2 GB) |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Supply Voltage (VDD) | — | 1.2 V |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Refresh | — | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Tipo de interfaz | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Estado del ciclo de vida | — | Active production |