H5TC4G63AFR-PBR vs H5TC4G63MFR-PBA Comparación
Comparación detallada lado a lado de H5TC4G63AFR-PBR por SK hynix y H5TC4G63MFR-PBA por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5TC4G63AFR-PBR | H5TC4G63MFR-PBA |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,91 | $6,50 |
| Tipo de memoria | DDR3L SDRAM | DDR3L SDRAM |
| Organización de memoria | 256M x 16 | 256M x 16 |
| Total Capacity | 4Gb | — |
| Tensión de alimentación | 1.35V (1.5V compatible) | — |
| Velocidad de datos | 1600 Mbps (PC3L-12800) | 1866 Mbps (PC3L-14900) |
| Latencia CAS | 11 | — |
| tRCD/tRP | 11 | — |
| Clock Frequency | 800 MHz | — |
| tCK | 1.25 ns | — |
| tRCD | 13.125 ns | — |
| Burst Length | 8 (BL8) with burst chop (BC4) | BL8, BL4 (with burst chop) |
| Number of Banks | 8 | 8 |
| Refresh Interval | 7.8us at 85C, 3.9us at 95C | — |
| Encapsulado | 96-ball FBGA (PBGA96) | 96-ball FBGA |
| Package Dimensions | 13.5mm x 9.0mm | — |
| Ball Pitch | 0.8mm | — |
| I/O Interface | SSTL-15 | — |
| Temperatura de funcionamiento | 0C to +95C | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Sin halógenos | Yes | — |
| Density | — | 4 Gb |
| Supply Voltage (VDD/VDDQ) | — | 1.35V (+0.100V/-0.067V) |
| CAS Latency (CL) | — | Programmable |
| CAS Write Latency (CWL) | — | Programmable |
| Additive Latency | — | Programmable |
| On-Die Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| Auto Self-Refresh | — | Yes |
| Temperature-Compensated Self-Refresh | — | Yes |
| Process Technology | — | 30nm-class |
| RoHS Compliant | — | Yes (Lead-Free & Halogen-Free) |