H5TC4G63MFR-PBA vs H5TC4G63AFR-PBR Comparación
Comparación detallada lado a lado de H5TC4G63MFR-PBA por SK hynix y H5TC4G63AFR-PBR por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5TC4G63MFR-PBA | H5TC4G63AFR-PBR |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,50 | $5,91 |
| Tipo de memoria | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | — |
| Organización de memoria | 256M x 16 | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V (+0.100V/-0.067V) | — |
| Velocidad de datos | 1866 Mbps (PC3L-14900) | 1600 Mbps (PC3L-12800) |
| Encapsulado | 96-ball FBGA | 96-ball FBGA (PBGA96) |
| Number of Banks | 8 | 8 |
| Burst Length | BL8, BL4 (with burst chop) | 8 (BL8) with burst chop (BC4) |
| CAS Latency (CL) | Programmable | — |
| CAS Write Latency (CWL) | Programmable | — |
| Additive Latency | Programmable | — |
| On-Die Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| Auto Self-Refresh | Yes | — |
| Temperature-Compensated Self-Refresh | Yes | — |
| Process Technology | 30nm-class | — |
| RoHS Compliant | Yes (Lead-Free & Halogen-Free) | — |
| Total Capacity | — | 4Gb |
| Tensión de alimentación | — | 1.35V (1.5V compatible) |
| Latencia CAS | — | 11 |
| tRCD/tRP | — | 11 |
| Clock Frequency | — | 800 MHz |
| tCK | — | 1.25 ns |
| tRCD | — | 13.125 ns |
| Refresh Interval | — | 7.8us at 85C, 3.9us at 95C |
| Package Dimensions | — | 13.5mm x 9.0mm |
| Ball Pitch | — | 0.8mm |
| I/O Interface | — | SSTL-15 |
| Temperatura de funcionamiento | — | 0C to +95C |
| RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Sin halógenos | — | Yes |