K3K8K80BM-JGCT vs K3K9K90BM-MGCP Comparación
Comparación detallada lado a lado de K3K8K80BM-JGCT por Samsung Electronics y K3K9K90BM-MGCP por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics
K3K8K80BM-JGCT ✓ ActivoComparación de especificaciones
| Parámetro | K3K8K80BM-JGCT | K3K9K90BM-MGCP |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,10 | $47,15 |
| Manufacturer | Samsung Electronics | — |
| Product Family | K3K mobile DRAM (LPDDR) component series | — |
| Tipo de memoria | Low Power DRAM (LPDDR) component | LPDDR5 SDRAM (CMOS) |
| Density | [DATA_NEEDED: die density in Gb] | — |
| Organización de memoria | [DATA_NEEDED: x8/x16 organization] | [DATA_NEEDED: density and organization] |
| Interfaz | [DATA_NEEDED: LPDDR4X or LPDDR5] | — |
| Maximum Data Rate | [DATA_NEEDED: Mbps] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: core supply voltage] | [DATA_NEEDED: VDD voltage] |
| Supply Voltage (VDDQ) | [DATA_NEEDED: I/O supply voltage] | — |
| Package Type | FBGA (Ball Grid Array) | — |
| Ball Count | [DATA_NEEDED: package ball count] | [DATA_NEEDED: ball count] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Speed Grade Suffix | J (per Samsung speed-grade coding) | — |
| Packing Suffix | CT (per Samsung packing-code convention) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Pin Speed | — | Up to 6400 Mbps (family maximum per Samsung LPDDR5 page) |
| Interface Width | — | x32 (family standard for K3K/K3L BM packages) |
| Encapsulado | — | PBGA (Plastic Ball Grid Array) |
| Refresh | — | Self-refresh with per-bank refresh support (LPDDR5 standard) |
| Power Saving vs LPDDR4X | — | Approximately 20% (Samsung published figure) |
| Max Bandwidth | — | Up to 51.2 GB/s (family maximum per Samsung LPDDR5 page) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Clocking | — | WCK (word clock) architecture |
| Standards | — | JEDEC LPDDR5 |