K3K8K80BM-JGCT vs K3K9K90BM-MGCP Сравнение

Подробное сравнение бок о бок K3K8K80BM-JGCT от Samsung Electronics и K3K9K90BM-MGCP от Samsung Electronics. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.

Samsung Electronics
K3K8K80BM-JGCT K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics

K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics

K3K8K80BM-JGCT ✓ Активен
Samsung Electronics
K3K9K90BM-MGCP K3K9K90BM-MGCP - LPDDR5 DRAM | Samsung Semiconductor

K3K9K90BM-MGCP - LPDDR5 DRAM | Samsung Semiconductor

K3K9K90BM-MGCP ✓ Активен

Сравнение характеристик

Параметр K3K8K80BM-JGCT K3K9K90BM-MGCP
Бренд Samsung Electronics Samsung Electronics
Категория Memory ICs Memory ICs
Статус жизненного цикла Активен Активен
Наличие In Stock In Stock
Цена за единицу (USD) $3,10 $47,15
Manufacturer Samsung Electronics —
Product Family K3K mobile DRAM (LPDDR) component series —
Тип памяти Low Power DRAM (LPDDR) component LPDDR5 SDRAM (CMOS)
Density [DATA_NEEDED: die density in Gb] —
Организация памяти [DATA_NEEDED: x8/x16 organization] [DATA_NEEDED: density and organization]
Интерфейс [DATA_NEEDED: LPDDR4X or LPDDR5] —
Maximum Data Rate [DATA_NEEDED: Mbps] —
Supply Voltage (VDD) [DATA_NEEDED: core supply voltage] [DATA_NEEDED: VDD voltage]
Supply Voltage (VDDQ) [DATA_NEEDED: I/O supply voltage] —
Package Type FBGA (Ball Grid Array) —
Ball Count [DATA_NEEDED: package ball count] [DATA_NEEDED: ball count]
Тип монтажа Surface Mount Surface Mount
Рабочая температура [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Speed Grade Suffix J (per Samsung speed-grade coding) —
Packing Suffix CT (per Samsung packing-code convention) —
Статус RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Уровень MSL [DATA_NEEDED: moisture sensitivity level] —
Pin Speed — Up to 6400 Mbps (family maximum per Samsung LPDDR5 page)
Interface Width — x32 (family standard for K3K/K3L BM packages)
Корпус — PBGA (Plastic Ball Grid Array)
Refresh — Self-refresh with per-bank refresh support (LPDDR5 standard)
Power Saving vs LPDDR4X — Approximately 20% (Samsung published figure)
Max Bandwidth — Up to 51.2 GB/s (family maximum per Samsung LPDDR5 page)
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Clocking — WCK (word clock) architecture
Standards — JEDEC LPDDR5

Даташиты & ресурсы

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