K3KL5L50QM-JGCT vs K3KL9L90DM-JGCT Comparación
Comparación detallada lado a lado de K3KL5L50QM-JGCT por Samsung Electronics y K3KL9L90DM-JGCT por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K3KL5L50QM-JGCT - 128Gb LPDDR5X 7500Mbps DRAM | Samsung
K3KL5L50QM-JGCT ✗ Fin de vidaSamsung Electronics
K3KL9L90DM-JGCT - LPDDR5X DRAM 16Gbit FBGA-315 | Samsung
K3KL9L90DM-JGCT ✓ ActivoComparación de especificaciones
| Parámetro | K3KL5L50QM-JGCT | K3KL9L90DM-JGCT |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,00 | $65,18 |
| Tipo de memoria | LPDDR5X DRAM (volatile) | LPDDR5X SDRAM |
| Tamaño de memoria | 128 Gb (16 GB) | — |
| Memory Organization | x64 | — |
| Interface Speed | 7500 Mbps (LPDDR5X-7500) | — |
| Tipo de interfaz | LPDDR5X parallel interface | — |
| Supply Voltage (VDD1) | 1.8 V | — |
| Supply Voltage (VDD2) | 1.05 V | — |
| Supply Voltage (VDD2Q/other) | 0.9 V | — |
| Supply Voltage (VDDQ) | 0.5 V | — |
| Temperatura de funcionamiento | -25C to +85C | -25C to +85C |
| Encapsulado | 441-ball FBGA | FBGA-315 |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Technology | LPDDR5X (JEDEC LPDDR5 extended) | — |
| Application Class | AI, in-vehicle and mobile devices | — |
| Product Status | EOL (End of Life) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Density | — | 16 Gbit |
| Velocidad de datos | — | [DATA_NEEDED: data rate for JGCT speed grade] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| Organización de memoria | — | [DATA_NEEDED: x organization] |
| Bank Architecture | — | [DATA_NEEDED: bank/group configuration] |
| Interfaz | — | [DATA_NEEDED: channel configuration] |
| Package Dimensions | — | [DATA_NEEDED: body dimensions] |
| AEC-Q100 | — | [DATA_NEEDED: automotive qualification status] |