K3KL9L90CM-MGCT vs K3KL9L90DM-JGCT Comparación
Comparación detallada lado a lado de K3KL9L90CM-MGCT por Samsung Electronics y K3KL9L90DM-JGCT por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K3KL9L90CM-MGCT - 64Gb LPDDR5X 7500Mbps x32 DRAM | Samsung
K3KL9L90CM-MGCT ✓ ActivoSamsung Electronics
K3KL9L90DM-JGCT - LPDDR5X DRAM 16Gbit FBGA-315 | Samsung
K3KL9L90DM-JGCT ✓ ActivoComparación de especificaciones
| Parámetro | K3KL9L90CM-MGCT | K3KL9L90DM-JGCT |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $36,91 | $65,18 |
| Tipo de memoria | LPDDR5X SDRAM (DRAM) | LPDDR5X SDRAM |
| Tamaño de memoria | 64 Gbit (8 GByte) | — |
| Memory Organization | x32 | — |
| Maximum Data Rate | 7500 Mbps | — |
| Interfaz | LPDDR5X | [DATA_NEEDED: channel configuration] |
| Supply Voltages | 500 mV / 900 mV / 1.05 V / 1.8 V | — |
| VDDQ | 500 mV | — |
| Temperatura de funcionamiento | -25C to +85C | -25C to +85C |
| Encapsulado | FBGA-315 (BGA-315) | FBGA-315 |
| Ball Pitch | 0.8 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (per JLCPCB listing) | Compliant |
| Product Status | Active | — |
| Typical Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules | — |
| Memory Standard | JEDEC LPDDR5X-class (JESD209-5B family) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Latencia CAS | [DATA_NEEDED: CAS latency] | — |
| Density | — | 16 Gbit |
| Velocidad de datos | — | [DATA_NEEDED: data rate for JGCT speed grade] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| Organización de memoria | — | [DATA_NEEDED: x organization] |
| Bank Architecture | — | [DATA_NEEDED: bank/group configuration] |
| Package Dimensions | — | [DATA_NEEDED: body dimensions] |
| AEC-Q100 | — | [DATA_NEEDED: automotive qualification status] |