K3LK4L40DM-BGCT vs K3KL3L30CM-BGCU Comparación

Comparación detallada lado a lado de K3LK4L40DM-BGCT por Samsung Electronics y K3KL3L30CM-BGCU por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Samsung Electronics
K3LK4L40DM-BGCT K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT ✓ Activo
Samsung Electronics
K3KL3L30CM-BGCU K3KL3L30CM-BGCU - 64Gb LPDDR5X DRAM 8533Mbps | Samsung

K3KL3L30CM-BGCU - 64Gb LPDDR5X DRAM 8533Mbps | Samsung

K3KL3L30CM-BGCU ✓ Activo

Comparación de especificaciones

Parámetro K3LK4L40DM-BGCT K3KL3L30CM-BGCU
Marca Samsung Electronics Samsung Electronics
Categoría DRAM Memory ICs
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $40,50 $0,00
Tipo de memoria DRAM (SDRAM component) LPDDR5X SDRAM (Volatile DRAM)
Manufacturer Samsung Electronics —
Density [DATA_NEEDED: Density] —
Organization (x-width) [DATA_NEEDED: Organization] —
Velocidad de datos [DATA_NEEDED: Data Rate] 8533 Mbps
Supply Voltage Class [DATA_NEEDED: Supply Voltage] [DATA_NEEDED: VDD/VDDQ voltage]
Latencia CAS [DATA_NEEDED: CAS Latency] —
Package Type BGA (per -BGC ordering-code suffix) —
Package Ball Count [DATA_NEEDED: Ball Count] —
Tipo de montaje Surface Mount Surface Mount
Temperatura de funcionamiento [DATA_NEEDED: Operating Temperature Range] [DATA_NEEDED: operating temperature range]
Refresh Rate [DATA_NEEDED: Refresh Interval] —
Estado RoHS [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Lead Free [DATA_NEEDED: Lead-Free Status] —
Nivel MSL [DATA_NEEDED: Moisture Sensitivity Level] [DATA_NEEDED: moisture sensitivity level]
Packaging Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] —
Tamaño de memoria — 64 Gb (8 GB)
Memory Organization — x64
Technology — LPDDR5X (JEDEC LPDDR5X-class low-power DRAM)
Encapsulado — FBGA-496 (BGCU)
Die Configuration — Stacked multi-die DRAM
Interfaz — LPDDR5X (standard LPDDR ball interface)
Application Segment — AI devices and automotive
Power Efficiency — Approx. 25% better than previous LPDDR5 generation (per Samsung)
Speed Improvement — Up to 1.25x faster than previous generation (per Samsung)
Place of Origin (per distributor listing) — Johor, Malaysia

Hojas de datos y recursos

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