K4AAG165WA-BCTD vs K4AAG165WA-BCPB Comparación
Comparación detallada lado a lado de K4AAG165WA-BCTD por Samsung Electronics y K4AAG165WA-BCPB por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ ActivoComparación de especificaciones
| Parámetro | K4AAG165WA-BCTD | K4AAG165WA-BCPB |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $60,59 | $63,79 |
| Tipo de memoria | DDR4 SDRAM | Volatile DRAM (DDR4 SDRAM) |
| Tamaño de memoria | 16 Gb | — |
| Memory Organization | 1G x 16 | — |
| Velocidad de datos | 2666 Mbps | 3200 Mbps |
| Tensión de alimentación | 1.2 V | — |
| Interfaz | Synchronous, DDR4 | — |
| Temperatura de funcionamiento | 0C to +85C | [DATA_NEEDED: operating temperature for BCPB grade] |
| Encapsulado | 96-FBGA | FBGA-96 |
| Tipo de montaje | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | DRAM |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Technology | — | DDR4 |
| Density | — | 16 Gb |
| Organización de memoria | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Interface Voltage (VDDQ) | — | 1.2 V |
| Packaging | — | Tray |
| Product Status | — | Active |
| Power Consumption | — | 25% lower than DDR3 (per Samsung DDR4 family) |
| Bank Group Architecture | — | Yes (DDR4 internal bank groups) |
| On-Die Termination (ODT) | — | Yes |
| Max Capacity Family | — | Up to 32GB component (Samsung DDR4 family) |