M1AFS1500-1FG256I vs M1AFS600-2FG256 Comparación
Comparación detallada lado a lado de M1AFS1500-1FG256I por Microchip Technology y M1AFS600-2FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ ActivoMicrochip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FG256I | M1AFS600-2FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $46,75 |
| Logic Capacity | 1,500,000 system gates | — |
| User I/O | 119 | — |
| Processor Core | ARM Cortex-M1 (M1 variant) | — |
| Memory Resource | 276480 bits | — |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm CMOS, 7-layer metal | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| System Performance | up to 350 MHz | — |
| Encapsulado | 256-LBGA (FG256) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +85C (industrial grade, suffix I) | — |
| Speed Grade | -1 (standard) | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Analog Functionality | Fusion configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | On-chip clock generation and management (PLL) |
| Estado RoHS | Non-Compliant (contains lead, per distributor data) | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Contains Lead | — |
| Series | — | M1AFS600 (Fusion) |
| System Gates | — | 600000 gates |
| Logic Elements | — | 110592 |
| Embedded Processor | — | ARM Cortex-M1 |
| Number of I/Os | — | 119 I/O |
| Technology | — | 130 nm flash-based |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA-256) |
| Estilo de montaje | — | SMD/SMT |
| Operating Temperature - Minimum | — | 0 C |
| Operating Temperature - Maximum | — | +70 C |
| Packaging | — | Tray |
| Analog Peripherals | — | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | — | Large flash memory blocks |
| Configuration | — | Flash-based, live at power-up, no external config PROM required |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum fabric operating frequency] |