M1AFS1500-1FG256I vs M1AFS600-2FG256 Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FG256I von Microchip Technology und M1AFS600-2FG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ AktivMicrochip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FG256I | M1AFS600-2FG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $46,75 |
| Logic Capacity | 1,500,000 system gates | — |
| User I/O | 119 | — |
| Processor Core | ARM Cortex-M1 (M1 variant) | — |
| Memory Resource | 276480 bits | — |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm CMOS, 7-layer metal | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| System Performance | up to 350 MHz | — |
| Gehäuse | 256-LBGA (FG256) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +85C (industrial grade, suffix I) | — |
| Speed Grade | -1 (standard) | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Analog Functionality | Fusion configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | On-chip clock generation and management (PLL) |
| RoHS-Status | Non-Compliant (contains lead, per distributor data) | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Contains Lead | — |
| Series | — | M1AFS600 (Fusion) |
| System Gates | — | 600000 gates |
| Logic Elements | — | 110592 |
| Embedded Processor | — | ARM Cortex-M1 |
| Number of I/Os | — | 119 I/O |
| Technology | — | 130 nm flash-based |
| Gehäuse / Bauform | — | 256-LBGA (FBGA-256) |
| Montagestil | — | SMD/SMT |
| Operating Temperature - Minimum | — | 0 C |
| Operating Temperature - Maximum | — | +70 C |
| Packaging | — | Tray |
| Analog Peripherals | — | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | — | Large flash memory blocks |
| Configuration | — | Flash-based, live at power-up, no external config PROM required |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum fabric operating frequency] |