M1AFS1500-2FG676I vs M1AFS1500-1FG676I Comparación
Comparación detallada lado a lado de M1AFS1500-2FG676I por Microchip Technology y M1AFS1500-1FG676I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActivoMicrochip Technology
M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
M1AFS1500-1FG676I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-2FG676I | M1AFS1500-1FG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $405,00 | $340,59 |
| Family | Fusion (Mixed-Signal Flash FPGA) | — |
| System Gates | 1.5 M | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | 2 | -1 |
| Encapsulado | 676-ball FBGA (FG676) | — |
| Tipo de montaje | Surface Mount | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Rango de temperatura de funcionamiento | Industrial (I suffix) -40C to +100C | — |
| Embedded Analog Features | On-chip ADC, clock conditioning circuit (CCC), power-on reset | — |
| External Configuration Device | Not required | — |
| Estado RoHS | RoHS Non-Compliant (contains lead) | RoHS Non-Compliant |
| Lead Free Status | Contains Lead | Contains Lead |
| Packaging Method | Tray | — |
| Number of User I/O | [DATA_NEEDED: Number of User I/O] | — |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | — |
| DLL/PLL Blocks | [DATA_NEEDED: Number of CCC blocks] | — |
| Manufacturer Part Number | — | M1AFS1500-1FG676I |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Product Type | — | Fusion Mixed-Signal FPGA |
| Number of Gates | — | 1.5 M |
| Number of I/O | — | 252 |
| Encapsulado / Carcasa | — | 676-Pin FBGA |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 (168 Hours) |
| Peak Reflow Time | — | 30 s |
| Packaging | — | Tray |