M1AFS1500-2FG676I vs M1AFS1500-1FG676I 对比

详细并排对比 M1AFS1500-2FG676I 出自 Microchip Technology 和 M1AFS1500-1FG676I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ 量产中
Microchip Technology
M1AFS1500-1FG676I M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip

M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip

M1AFS1500-1FG676I ✓ 量产中

规格对比

参数 M1AFS1500-2FG676I M1AFS1500-1FG676I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $405.00 $340.59
Family Fusion (Mixed-Signal Flash FPGA) —
System Gates 1.5 M —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V 1.5 V
Speed Grade 2 -1
封装 676-ball FBGA (FG676) —
安装类型 Surface Mount —
Configuration Memory On-chip flash (non-volatile, instant-on) —
工作温度范围 Industrial (I suffix) -40C to +100C —
Embedded Analog Features On-chip ADC, clock conditioning circuit (CCC), power-on reset —
External Configuration Device Not required —
RoHS 状态 RoHS Non-Compliant (contains lead) RoHS Non-Compliant
Lead Free Status Contains Lead Contains Lead
Packaging Method Tray —
Number of User I/O [DATA_NEEDED: Number of User I/O] —
Embedded SRAM [DATA_NEEDED: Embedded SRAM capacity] —
DLL/PLL Blocks [DATA_NEEDED: Number of CCC blocks] —
Manufacturer Part Number — M1AFS1500-1FG676I
Manufacturer — Microchip Technology (Microsemi)
Product Type — Fusion Mixed-Signal FPGA
Number of Gates — 1.5 M
Number of I/O — 252
封装 / 外壳 — 676-Pin FBGA
安装方式 — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
湿敏等级(MSL) — 3 (168 Hours)
Peak Reflow Time — 30 s
Packaging — Tray

数据手册与资源

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