M1AFS1500-2FG676I vs M1AFS1500-1FG676I Comparaison
Comparaison détaillée côte à côte de M1AFS1500-2FG676I par Microchip Technology et M1AFS1500-1FG676I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActifMicrochip Technology
M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
M1AFS1500-1FG676I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-2FG676I | M1AFS1500-1FG676I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $405,00 | $340,59 |
| Family | Fusion (Mixed-Signal Flash FPGA) | — |
| System Gates | 1.5 M | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | 2 | -1 |
| Boîtier | 676-ball FBGA (FG676) | — |
| Type de montage | Surface Mount | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Plage de température de fonctionnement | Industrial (I suffix) -40C to +100C | — |
| Embedded Analog Features | On-chip ADC, clock conditioning circuit (CCC), power-on reset | — |
| External Configuration Device | Not required | — |
| Statut RoHS | RoHS Non-Compliant (contains lead) | RoHS Non-Compliant |
| Lead Free Status | Contains Lead | Contains Lead |
| Packaging Method | Tray | — |
| Number of User I/O | [DATA_NEEDED: Number of User I/O] | — |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | — |
| DLL/PLL Blocks | [DATA_NEEDED: Number of CCC blocks] | — |
| Manufacturer Part Number | — | M1AFS1500-1FG676I |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Product Type | — | Fusion Mixed-Signal FPGA |
| Number of Gates | — | 1.5 M |
| Number of I/O | — | 252 |
| Boîtier / Format | — | 676-Pin FBGA |
| Style de montage | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Niveau de sensibilité à l'humidité (MSL) | — | 3 (168 Hours) |
| Peak Reflow Time | — | 30 s |
| Packaging | — | Tray |