M1AFS1500-2FGG256 vs M1AFS1500-1FG256I Comparación
Comparación detallada lado a lado de M1AFS1500-2FGG256 por Microchip Technology y M1AFS1500-1FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ ActivoMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-2FGG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $124,50 | $205,00 |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | -1 (standard) |
| Encapsulado / Carcasa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montaje | SMD/SMT | — |
| Rango de temperatura de funcionamiento | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| Core Supply Voltage | — | 1.5 V |
| System Performance | — | up to 350 MHz |
| Encapsulado | — | 256-LBGA (FG256) |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | -40C to +85C (industrial grade, suffix I) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Clock Management | — | Integrated clock generation and management circuitry |
| Estado RoHS | — | Non-Compliant (contains lead, per distributor data) |
| Lead-Free Status | — | Contains Lead |