M1AFS1500-2FGG256 vs M1AFS1500-1FG256I Vergleich
Detaillierter Direktvergleich von M1AFS1500-2FGG256 von Microchip Technology und M1AFS1500-1FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ AktivMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-2FGG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $124,50 | $205,00 |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Maximale Taktfrequenz | 350 MHz | — |
| Number of I/O | 119 | — |
| Betriebsversorgungsspannung | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | -1 (standard) |
| Gehäuse / Bauform | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Montagestil | SMD/SMT | — |
| Betriebstemperaturbereich | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| Core Supply Voltage | — | 1.5 V |
| System Performance | — | up to 350 MHz |
| Gehäuse | — | 256-LBGA (FG256) |
| Montageart | — | Surface Mount |
| Betriebstemperatur | — | -40C to +85C (industrial grade, suffix I) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Clock Management | — | Integrated clock generation and management circuitry |
| RoHS-Status | — | Non-Compliant (contains lead, per distributor data) |
| Lead-Free Status | — | Contains Lead |