M1AFS1500-2FGG484I vs M1AFS1500-2FG676I Comparación
Comparación detallada lado a lado de M1AFS1500-2FGG484I por Microchip Technology y M1AFS1500-2FG676I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
M1AFS1500-2FGG484I ✓ ActivoMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-2FGG484I | M1AFS1500-2FG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $201,11 | $405,00 |
| Family | Fusion (M1 series) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1500000 gates | 1.5 M |
| Logic Cells | 38400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| User I/O | 223 | — |
| Flash Configuration Memory | 276480 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based CMOS | 130 nm CMOS |
| Speed Grade | 2 (25% faster than standard) | 2 |
| Encapsulado | 484-ball FBGA (FGG484), 1.00 mm ball pitch | 676-ball FBGA (FG676) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial, junction) | — |
| Programmability | In-system reprogrammable flash (LivePro) | — |
| Volatility | Non-volatile (on-chip flash configuration) | — |
| Analog Peripherals | Mixed-signal configurable analog blocks | — |
| Clock Management | Comprehensive clock generation and management (CCM) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Rango de temperatura de funcionamiento | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |