M1AFS1500-2FGG484I vs M1AFS1500-2FG676I Comparaison
Comparaison détaillée côte à côte de M1AFS1500-2FGG484I par Microchip Technology et M1AFS1500-2FG676I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
M1AFS1500-2FGG484I ✓ ActifMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-2FGG484I | M1AFS1500-2FG676I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $201,11 | $405,00 |
| Family | Fusion (M1 series) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1500000 gates | 1.5 M |
| Logic Cells | 38400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| User I/O | 223 | — |
| Flash Configuration Memory | 276480 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based CMOS | 130 nm CMOS |
| Speed Grade | 2 (25% faster than standard) | 2 |
| Boîtier | 484-ball FBGA (FGG484), 1.00 mm ball pitch | 676-ball FBGA (FG676) |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial, junction) | — |
| Programmability | In-system reprogrammable flash (LivePro) | — |
| Volatility | Non-volatile (on-chip flash configuration) | — |
| Analog Peripherals | Mixed-signal configurable analog blocks | — |
| Clock Management | Comprehensive clock generation and management (CCM) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Plage de température de fonctionnement | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |