M1AFS1500-2FGG484I vs M1AFS1500-2FG676I Vergleich

Detaillierter Direktvergleich von M1AFS1500-2FGG484I von Microchip Technology und M1AFS1500-2FG676I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS1500-2FGG484I M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip

M1AFS1500-2FGG484I ✓ Aktiv
Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS1500-2FGG484I M1AFS1500-2FG676I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $201,11 $405,00
Family Fusion (M1 series) Fusion (Mixed-Signal Flash FPGA)
System Gates 1500000 gates 1.5 M
Logic Cells 38400 —
Embedded Processor ARM Cortex-M1 —
User I/O 223 —
Flash Configuration Memory 276480 bits —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm flash-based CMOS 130 nm CMOS
Speed Grade 2 (25% faster than standard) 2
Gehäuse 484-ball FBGA (FGG484), 1.00 mm ball pitch 676-ball FBGA (FG676)
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +100C (Industrial, junction) —
Programmability In-system reprogrammable flash (LivePro) —
Volatility Non-volatile (on-chip flash configuration) —
Analog Peripherals Mixed-signal configurable analog blocks —
Clock Management Comprehensive clock generation and management (CCM) —
RoHS-Status [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead)
Configuration Memory — On-chip flash (non-volatile, instant-on)
Betriebstemperaturbereich — Industrial (I suffix) -40C to +100C
Embedded Analog Features — On-chip ADC, clock conditioning circuit (CCC), power-on reset
External Configuration Device — Not required
Lead Free Status — Contains Lead
Packaging Method — Tray
Number of User I/O — [DATA_NEEDED: Number of User I/O]
Embedded SRAM — [DATA_NEEDED: Embedded SRAM capacity]
DLL/PLL Blocks — [DATA_NEEDED: Number of CCC blocks]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern