M1AFS600-2FG256 vs M1AFS1500-1FG256I Comparación
Comparación detallada lado a lado de M1AFS600-2FG256 por Microchip Technology y M1AFS1500-1FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActivoMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS600-2FG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,75 | $205,00 |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | — |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash-based | — |
| Encapsulado / Carcasa | 256-LBGA (FBGA-256) | — |
| Estilo de montaje | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | Integrated clock generation and management circuitry |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (contains lead, per distributor data) |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| System Performance | — | up to 350 MHz |
| Encapsulado | — | 256-LBGA (FG256) |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | -40C to +85C (industrial grade, suffix I) |
| Speed Grade | — | -1 (standard) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Lead-Free Status | — | Contains Lead |