M1AFS600-2FG256 vs M1AFS1500-1FG256I Comparaison
Comparaison détaillée côte à côte de M1AFS600-2FG256 par Microchip Technology et M1AFS1500-1FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActifMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS600-2FG256 | M1AFS1500-1FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $46,75 | $205,00 |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | — |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash-based | — |
| Boîtier / Format | 256-LBGA (FBGA-256) | — |
| Style de montage | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | Integrated clock generation and management circuitry |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (contains lead, per distributor data) |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Processor Core | — | ARM Cortex-M1 (M1 variant) |
| Memory Resource | — | 276480 bits |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| System Performance | — | up to 350 MHz |
| Boîtier | — | 256-LBGA (FG256) |
| Type de montage | — | Surface Mount |
| Température de fonctionnement | — | -40C to +85C (industrial grade, suffix I) |
| Speed Grade | — | -1 (standard) |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Lead-Free Status | — | Contains Lead |