M1AFS600-2FG256 vs M1AFS1500-1FG256I Comparação

Comparação detalhada lado a lado de M1AFS600-2FG256 por Microchip Technology e M1AFS1500-1FG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ Ativo
Microchip Technology
M1AFS1500-1FG256I M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I ✓ Ativo

Comparação de especificações

Parâmetro M1AFS600-2FG256 M1AFS1500-1FG256I
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $46,75 $205,00
Series M1AFS600 (Fusion) —
System Gates 600000 gates —
Logic Elements 110592 —
Embedded Processor ARM Cortex-M1 —
Number of I/Os 119 I/O —
Core Supply Voltage 1.5 V 1.5 V
Technology 130 nm flash-based —
Encapsulamento / Caixa 256-LBGA (FBGA-256) —
Estilo de montagem SMD/SMT —
Operating Temperature - Minimum 0 C —
Operating Temperature - Maximum +70 C —
Packaging Tray —
Analog Peripherals Configurable analog block (Fusion mixed-signal) —
On-chip Memory Large flash memory blocks —
Clock Management On-chip clock generation and management (PLL) Integrated clock generation and management circuitry
Configuration Flash-based, live at power-up, no external config PROM required —
Status RoHS [DATA_NEEDED: RoHS status] Non-Compliant (contains lead, per distributor data)
Maximum Operating Frequency [DATA_NEEDED: maximum fabric operating frequency] —
Logic Capacity — 1,500,000 system gates
User I/O — 119
Processor Core — ARM Cortex-M1 (M1 variant)
Memory Resource — 276480 bits
Configuration Technology — Flash-based, nonvolatile
Process Technology — 130 nm CMOS, 7-layer metal
System Performance — up to 350 MHz
Encapsulamento — 256-LBGA (FG256)
Tipo de montagem — Surface Mount
Temperatura de operação — -40C to +85C (industrial grade, suffix I)
Speed Grade — -1 (standard)
Power-Up Behavior — Live at Power-Up (LAPU)
Analog Functionality — Fusion configurable analog blocks
Lead-Free Status — Contains Lead

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